Fujifilm exhibits new Direct Laser Engraving Flexo CTP System at Labelexpo Americas and FachPack

Fujifilm today announces that its new B2 Direct Laser Engraving (DLE) Flexo CTP System will be exhibited for the first time in the United States on stand #1241 Hall A at Labelexpo Americas 2010, followed by its European debut on stand 336, Hall 7 at the FachPack 2010 exhibition in Nuremberg.

By developing a new DLE plate and multi-channel CTP platesetter, Fujifilm has created a revolutionary new solution for flexo label and packaging print applications.  Thanks to the use of unique plate and imaging technologies, the Fujifilm DLE Flexo CTP System provides the following benefits:

Simple plate production process:

Using a DLE Flexo CTP System eliminates the multiple processing steps (UV exposure, solvent or thermal processing, drying) that are required with existing Laser Ablation Mask (LAM) technologies.

Increased productivity:

The efficient thermal decomposition reaction in the exposed areas of the plate, together with multi-channel imaging technology, result in higher productivity.

Increased quality:

A highly-cured plate, manufactured using a unique polymerisation reaction, results in sharp and fine image reproduction.

Low cost of ownership:

Using DLE technology eliminates the need for costly UV exposure and development equipment.

Reduced environmental impact:

The Fujifilm DLE Flexo CTP solution is eco-friendly as it is completely 100% free of both VOCs and solvents.  And, the fact that there is no need for a lengthy, high temperature plate drying process results in a reduction in both energy consumption and greenhouse gas emissions.

Fujifilm is in the unique position of being able to offer benchmark printing solutions across a wide portfolio of applications, all based on the latest technologies.  The addition of this revolutionary new solution for flexo label and packaging print applications strengthens Fujifilm’s offering to the graphics industry.